Fɛɛn min be se ka kɛ, o be se ka kɛ
AOI Automatique sɛgɛsɛgɛri minanw be kɛ ka sanu juru ɲɔgɔndanw ka ɲumanya n’u ka tiɲɛtigiya lɔn chips pakew kan. A be baara kɛ ni 2D/3D kamera 2D/3D ani AI jaaw labɛncogo algorithme ye walisa ka sanu juru ɲɔgɔndanw lɔn joona ani k’u sɛgɛsɛgɛ ka ɲɛ. A be se ka paramɛtiriw lɔn i n’a fɔ soudure cogoya, a lɔyɔrɔ, a janya, a ka yɔrɔ, ani a ka paramɛtiri wɛrɛw, ani a be se ka kɛ ko a be ni fɛɛn caaman ye wala fiɲɛ sifa caaman, i n’a fɔ soudure man ɲi, a karinin lo, a be yɛlɛma ani gwɛlɛya wɛrɛw. N’an be gwɛlɛyaw lɔn ani k’u labɛn joona ni sanu nɛgɛw ye, o be dɛmɛ don ka fɛnw labɛn ka ɲɛ ani k’u lamaga ka ɲɛ ani ka fɛnw hakɛ dɔgɔya.
AOI Gold ka juru sirili .
Fɛɛn dɔw
1.Sɛgɛsɛgɛli sɛgɛsɛgɛli .
A’ ye nɔrɔnɔrɔ ka paramɛtiriw lɔn (a ka c’a la, sanu, zira wala aliminiyɔmu nɛgɛw), i n’a fɔ nɛgɛw janya, a janya, a lɔyɔrɔ, a bonya, a kari, a kurunin ani fiɲɛ wɛrɛw.
2.Sɛgɛsɛgɛri min be kɛ ɲɔgɔn fɛ .
Aw ye bonding points ka tilenninya sɛgɛsɛgɛ (a yɔrɔ fɔlɔ, solder filanan), i n’a fɔ a ka yɛlɛma, a ka mugu sumanin, a ka nɔgɔ, n’a ɲɔgɔnnaw.
3.3D cogoya yɛlɛmani .
O la, a be se ka kɛ ko 3D porofayili sumani be se ka kɛ sanu juru sumani ye min be kɛ ni mult-gelengle optique wala laser sɛgɛsɛgɛri ye.
Fɛɛnw ka jogow
AOI minɛnw ka optiki sisitɛmu ni lɔnniya algorithme be baara kɛ ni yɔrɔ caman ye, yɔrɔ min ka bon, a ka ca-}sensitivity kristali defect lɔnniya n’a sɛgɛsɛgɛli.
2D & 3D optional, 3D sumanin Z-}}*sas ka tiɲɛtigiya fɔɔ ka se 8 μm .
UPH: A ka bon ka tɛmɛ 5000pcs/h kan .
AOI 2D latigɛli
AOI 3D dantigɛli
Aplikasiyɔn
● AOI ka minanw sɛgɛsɛgɛ: nɛgɛ min be bɔ, nɛgɛ jugu, nɛgɛ fila, nɛgɛ fila, sanu juru, sanukuru surun, sɔgɔlan surunnin, jɛgɛ nɛgɛ, jɛgɛ nɛgɛ, sɔgɔlan XY bonya, jɛgɛ nɛgɛ, jɛgɛ minɛ, jɛgɛminɛfɛn min be se ka yɛlɛma, min be se ka yɛlɛma, nɔgɔ min be se ka yɛlɛma, nɔgɔ be se ka kɛ IC, min bɔra bolifɛn boli la, a ka bolifɛn nɔgɔnin IC, a be ni fotonsentif ye, a ye fotonsentive chip tiɲɛ, a be se ka yɛlɛma yɛlɛma.
AOI Otomatiki sɛgɛsɛgɛli minanw ye ɲɔgɔndan jɔnjɔn ye min b’a to nɔrɔli be se ka la a la ani a be kɛ ka caya ka ɲɛsin fɛnw ma minw be se ka yɛlɛma yɛlɛma semi-conducteur kɔfɛ-end pakew. N’i mako be fura ɲuman na, i ka Huizhou Zhongke Advanced Manufacturing Co., Ltd.
Tagasogow: automatiki sɛgɛsɛgɛri minanw, Sinuwaw ka sɛgɛsɛgɛrikɛminanw dilanbagaw, feerekɛlaw, izini .
Paramɛtiri fɛɛrɛmanw
● Resolution: 0,5 μm~5μm (min be kɛɲɛ ni lensɛriw labɛncogo ye)
● Detection teliya: kaare caaman ka taga se tan ni fila ma sekɔndi kelen kɔnɔ (o be taga ni yɔrɔ bonya ye)
● Nɛgɛ diamɛtiri min be se ka kɛ: 15 μm~100μm (filɛri sanulaman)
● A be se ka yɛlɛma: ±1μm3μm .
Fɛɛnw yiracogo
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Kɛnɛma bonya |
L1000*W800*H1500 mm |
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Fanga di |
2KW, AC220 V |
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Guliya |
800Kg |
